Consulting, Engineering, Process development,
Business development,…

Training courses in Berlin to customer engineering people,
On-site training at customer premises

Wafer services: Prototyping, Pilot Runs, Low Volume Manufacturing

Doublecheck Semiconductors offers Wafer Processing Service up to 300mm Wafers.
All processes available down to 50µm thinness and less...

   • Wafer thinning
   • Stress relief / Via reveal
   • Backside Via-last
   • Backside RDL & (Pillar-) Bumping
   • Backside ion implant
   • (Laser-)Annealing
   • Backside metallization & patterning
   • Wafer Level Test
   • Singulation

Doublecheck Semiconductors utilizes its very own resources as well as the network it has built to provide the most comprehensive skill set to help our customers to succeed in developing their technologies. For inquires on our capabilities and services, please contact us.